2017 |
Dielectric elastomer fingers with strength for nimble pinching |
劉義強,Lau G.K., Heng, K.M.*, Ahmed, A.*, Shrestha M |
Applied Physical Letters |
19 |
|
2017 |
Electrically tunable and broader-band sound absorption by using micro-perforated dielectric elastomer actuator |
劉義強,Lu, Z.B., Shrestha, M.*, Lau, G.K. |
Applied Physical Letters |
18 |
|
2017 |
Ink-jet printing of micro-electro-mechanical systems (MEMS) |
劉義強,Lau G-K, Shrestha, M. |
Micromachines |
6 |
|
2017 |
Cooling design and evaluation for photovoltaic cells within constrained space in a CPV/CSP hybrid solar system |
陳清榮(2023年退休),Wang, S., Shi, J., Chen, H.H., Schafer, S. R., Munir, M., Stecker, G., Pan, W., Lee, J. J., and Chen, C.L. |
Applied Thermal Engineering |
|
(EI) |
2017 |
A Hybrid Atomistic-Continuum Simulation of Nucleate Boiling with Domain Re-Decomposition Method |
陳清榮(2023年退休),Zhang, B, Mao, Y., Chen, C.L. and Zhang, Y. |
Numerical Heat Transfer |
|
(EI) |
2017 |
Coupled Natural Convection and Radiation Heat Transfer of Hybrid Solar Energy Conversion System |
陳清榮(2023年退休),Xu, H., Chen, H.H., Wang, S., Li, Z., Li, K., Stecker, G., Pan, W., Lee, J.J. and Chen, C.L. |
International Journal of Heat and Mass Transfer |
|
(EI) |
2017 |
Hybrid Atomistic-Continuum Simulation of Nanostructured Defects Induced Bubble Growth |
陳清榮(2023年退休),Mao, Y., Zhang, B., Chen, C.L. and Zhang, Y. |
Journal of Heat Transfer |
|
(EI) |
2017 |
Numerical investigation of condensation on microstructured surface with wettability patterns |
陳清榮(2023年退休),Ke, Z., Shi, J., Zhang, B., and Chen, C.L. |
International Journal of Heat and Mass Transfer |
|
(EI) |
2017 |
Bubble Detachment Assisted by Electrowetting-driven Interfacial Wave |
陳清榮(2023年退休),Xu, H., Yan, R., Wang, S., and Chen, C.L. |
Physics of Fluids |
|
(EI) |
2017 |
Performance Analysis of a Near-Field Thermophotovoltaic Device with a Metallodielectric Selective Emitter and Electrical Contacts for the Photovoltaic Cell, |
張瑞永,Yang, Y., Chang, J.-Y., Sabbaghi, P., and Wang, L.P., 2017 |
ASME Journal of Heat Transfer |
Vol. 139 |
|