Journal Paper
Year Paper Title Authors Journal Title Issue.No Level Type
2006 “An Amendment of the Generalized Friction Correlation for Louver Fin Geometry,” Chi-Chuan Wang ,Chang, Y.J., Chang, W.J., Li, M.C., and Wang, C.C. Int. J. of Heat and Mass Transfer
2006 “Flow Patterns of Two-Phase Flow in Vertical U-Type Return Bends,” Chi-Chuan Wang ,Wongwises S., Kamsanam, W., and Wang, C.C. AIAA J. of Thermophysics and Heat Transfer
2006 “A Simplified Transient Three-dimensional Model for Estimating the Thermal Performance of the Vapor Chambers,” Chi-Chuan Wang ,Chen, Y.S., Chien, K.H., Wang, C.C., Hung, T.C., and Pei, B.S. Applied Thermal Engineering,
2006 “Corrigendum to “Simultaneous Heat and Mass Transfer Characteristics for Wavy Fin-and-tube Heat Exchangers Under Dehumidifying Conditions” Chi-Chuan Wang ,Pirompugd W., Wongwises S., and Wang, C.C. Int. J. of Heat and Mass Transfer
2006 Enhancement of Thermal Conductivity With Cu for Nanofluids Using Chemical Reduction Method,” Chi-Chuan Wang ,Liu, M.S., Lin, M. C.C., Tsai, C.Y., and Wang, C.C. Int. J. of Heat and Mass Transfer
2006 Performance of Nozzle/Diffuser Micro-pump Subject to Parallel and Series Combinations,” Chi-Chuan Wang ,Yang, K.S., Chen, I.Y., and Wang, C.C. Chemical Engineering & Technology
2006 Effect of Fin Thickness on the Air-Side Performance of Wavy Fin-and-Tube Heat Exchangers under Dehumidifying Conditions,” Chi-Chuan Wang ,Kuvannarat T., Wongwises S., and Wang, C.C. Int. J. of Heat and Mass Transfer
2006 “Effect of the Inlet Location on the Performance of Parallel-channel Cold-plate,” Chi-Chuan Wang ,Lu, M.C., and Wang, C.C. IEEE Transactions on Components & Packaging Technologies
2006 “Simultaneous Heat and Mass Transfer Characteristics for Wavy Fin-and-Tube Heat Exchangers under Dehumidifying Conditions,” Chi-Chuan Wang ,Pirompugd W., Wongwises S., and Wang, C.C. Int. J. of Heat and Mass Transfer
2006 “Enhancement of Thermal Conductivity With CuO for Nanofluids,” Chi-Chuan Wang ,Liu, M.S., Lin, Mark C.-C., and Wang, C.C. Chemical Engineering & Technology,