Year | 2006 |
---|---|
Authors | Chi-Chuan Wang ,Liu, M.S., Lin, M. C.C., Tsai, C.Y., and Wang, C.C. |
Paper Title | Enhancement of Thermal Conductivity With Cu for Nanofluids Using Chemical Reduction Method,” |
Journal Title | Int. J. of Heat and Mass Transfer |
Vol.No | Vol. 49 |
Page(s) | 3028-3033 |
Language | Chinese |