| Year | 2006 |
|---|---|
| Authors | Chi-Chuan Wang ,Liu, M.S., Lin, M. C.C., Tsai, C.Y., and Wang, C.C. |
| Paper Title | Enhancement of Thermal Conductivity With Cu for Nanofluids Using Chemical Reduction Method,” |
| Journal Title | Int. J. of Heat and Mass Transfer |
| Vol.No | Vol. 49 |
| Page(s) | 3028-3033 |
| Language | Chinese |
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