期刊論文

年度 論文名稱 全部作者 期刊名稱 期數 期刊等級
2007 “Frictional Effect of Ultrasonic-vibration on Upsetting “ 洪景華 (2026年退休),Jung-Chung Hung, Yu-Chung Tsai and Chinghua Hung* Ultrasonics (SCI, EI)
2007 Simulation of Gear Shaving with Considerations of Cutter Assembly Errors and Machine Setting Parameters 洪景華 (2026年退休),Ching-Hua Hung, Jia-Hung Liu, Shinn-Liang Cheng*, and Hung-Jeng Lin The International Journal of Advanced Manufacturing Technology No. 3-4 (SCI, EI)
2007 Enhancement on forming complex three dimensional microstructures by a double-side multiple partial exposure method 徐文祥,Chung, Junwei and Hsu, Wensyang Journal of Vacuum Science and Technology B, and selected in the Virtual Journal of Nanoscale Science & Technology, October Issue, 2007 1671 (SCI, EI)
2007 Asymmetric Electrowetting - Moving Droplets by a Square Wave 徐文祥,Fan, S.-K., Yang, H., Wang, T.-T., and Hsu, W Lab on A Chip 7 (SCI)
2007 Design and fabrication of polymer microfludic substrates using the optical disc process 徐文祥,Wu, C.-H., Chen, C.-H., Fan, K.-W., Hsu, W. and Lin, Y.-C. Sensors and Actuators: A 1-2 (SCI, EI)
2007 “The Numerical Simulation for Flow and Pressure Distributions of Trains Movement in Tunnels,” 陳俊勳(2021年轉任國際半導體學院),W. K. Chang, Y. J. Hsieh, C. H. Chen and P. H. Lin CSME No. 5
2007 “Investigation of Cell Operation Conditions for CO Tolerance Improvement of PEMFC" 陳俊勳(2021年轉任國際半導體學院),C. C. Chung, C. H. Chen, D. C. Weng, Y. Y. Yan, H. H. Lin Journal of the Chinese Society of Mechanical Engineers No. 6
2007 “Numerical Study For Downward Flame Spread Over A Finite-Length PMMA With Radiation Effect,” 陳俊勳(2021年轉任國際半導體學院),W. K. Chang, C. H. Chen and T. M. Liou International Journal of Transport Phenomena No. 3
2007 “Effect of opposed flow on flame spread over a finite-length PMMA slab in a two-dimensional wind tunnel,” 陳俊勳(2021年轉任國際半導體學院)/W. K. Chang and C. H. Chen Combustion Science and Technology
2007 “Simulation and experimentation of a microfluidic device based on electrowetting on dielectric,” 陳俊勳(2021年轉任國際半導體學院),L. S. Jang, G. H. Lin, Y. L. Lin, C. Y. Hsu, W. H. Kan, C. H. Chen Biomedical Microdevices No. 6