期刊論文
年度 論文名稱 全部作者 期刊名稱 期數 期刊等級
2006 Identification of mechanical properties of elastically restrained laminated composite plates using vibration data 金大仁(2020年退休)/C. R. Lee and T. Y. Kam J. Sound and Vibration No.3-5 (SCI, EI)
2006 Elastic Constants Identification of Composite Materials Using a Single Angle-Ply Laminate 金大仁(2020年退休)/C. M. Chen and T. Y. Kam ASCE, J. Engineering Mechanics No.11 (SCI, EI)
2006 “Analysis of Stresses in Adhesive Joints Applicable to IC Chips Using Symbolic Manipulation and the Numerical Method“ 洪景華,Tung-Hua Cheng, Ching-Huan Tseng, and Chinghua Hung* Journal of Adhesion Science and Technology No. 15 (SCI, EI)
2006 A self-aligned process between the nano-aperture and solid immersion lens 徐文祥,Hung-Lung Hsu, Yu-Ru Chang, Yi Chiu, Yu-Hsin Lin and Wensyang Hsu Journal of Micromechanics and Microengineering (SCI, EI)
2006 Ni-CNTs Nanocomposite for Robust MEMS Fabrication 徐文祥,Li-Nuan Tsai, Yu-Ting Cheng, Wensyang Hsu, and Weileun Fang J. Vac. Sci. Tech. B. (SCI, EI)
2006 Performance Improvement of an Electrothermal Microactuator Fabricated Using Ni-Diamond Nanocomposite 徐文祥,Li-Nuan Tsai, Guang-Ren Shen, Yu-Ting Cheng and Wensyang Hsu IEEE/ASME Journal of Micro Electro Mechanical Systems 1 (SCI, EI)
2006 A Wafer-Level Hermetic Encapsulation for MEMS Manufacture Application 徐文祥,Zhi-Hao Liang, Yu-Ting Cheng, Wensyang Hsu, Yuh-Wen Lee IEEE Trans. on Adv. Packaging 3 (SCI, EI)
2006 Design and Fabrication of an Electrothermal Microactuator for Multi-level Conveying 徐文祥,Chien-Tai Wu, Wensyang Hsu Journal of Microsystem Technologies 4 (SCI, EI)
2006 Design and Characterization of Electrothermal Monolithic Long-Stretch Micro Drive with High Output Efficiency 徐文祥/W. Hsu IEEE/ASME Journal of Micro Electro Mechanical Systems 4 (SCI, EI)
2006 Effective surface treatments for selective epitaxial SiGe growth in locally strained pMOSFETs 徐文祥,Cheng, P.L., Liao, C.I., Wu, H.R., Chen, Y.C., Chien, C.C., Yang, C.L., Tzou, S.F., Tang, J., Kodali, R., Washington, L., Cho, Y., Chang, V.C., Fu, T., and Hsu, W. J. of Semiconductor Science and Technology 22 (SCI, EI)