2005 |
Development of a General-Purpose Parallel Three-Dimensional DSMC Code Using Unstructured Mesh |
吳宗信,J.-S. Wu, K.-C. Tseng, Y.-M. Lee, and Y.-Y. Lian |
6th Asian CFD Conference |
TAIWAN |
|
2005 |
"Organoclay Effect on Mechanical Behaviors of Fiber Reinforced Polymeric Nanocomposites" |
蔡佳霖,Jia-Lin Tsai, Jui-Ching Kuo and Shin-Ming Hsu |
The American Society for Composites, 20th Technical Conference |
Hsinchu, Taiwan |
(Others) |
2005 |
"Characterizing Nonlinear Rate Dependent Behaviors of Fiber Composites Using Micromechanical Approach" |
蔡佳霖,Kuei-Han Chen, Jui-Ching Kuo and Jia-Lin Tsai |
The American Society for Composites, 20th Technical Conference |
Drexel University, Philadelphia |
(Others) |
2005 |
CFD Thermal Analysis and Optimization of Motor Cooling Fin Design |
陳清榮(2023年退休),Chen, Y.C., Chen, B.C., Chen, C.L., and Dong, J. |
ASME Summer Heat Transfer Conference |
San Francisco, CaliforniaSan |
(EI) |
2005 |
Jet Impingement Cooling of an Inverter Module in the Harsh Environment of a Hybrid Vehicle |
陳清榮(2023年退休),Bhunia and Chen, C.L. |
ASME Summer Heat Transfer Conference |
San Francisco |
(EI) |
2005 |
Parallel Implementation of a 3-D Electrostatic PIC/MCC Method Using Unstructured Tetrahedral Mesh |
吳宗信/J.-S. Wu and K.-H. Hsu |
ICNSP-2005 (ATPPC-19) |
Nara, JAPAN |
|
2005 |
Validation and Applications of Chemical-Reactions Simulation in the Parallel DSMC Code (PDSC) |
吳宗信,K.-C. Tseng, J.-S. Wu* and I.D. Boyd |
6th Asian CFD Conference |
TAIWAN |
|
2005 |
Parallel Implementation of a 3-D Electrostatic PIC Method Using Unstrutured Mesh |
吳宗信/J.-S. Wu and K.-H. Hsu |
ICOPS-2005 (32nd IEEE Plasma Conference), |
Monterey, California, USA |
|
2005 |
Dynamic Domain Decomposition for a Parallel 3-D Electrostatic PIC/MCC Code Using Unstrutured Mesh |
吳宗信/J.-S. Wu and K.-H. Hsu |
ICOPS-2005 (32nd IEEE Plasma Conference) |
Montery, California, USA |
|
2005 |
Applications of advanced cooling technology in avionics system for aerospace vehicle |
陳清榮(2023年退休),Cai, Q., Chen, C.L., and Asfia, J.F. |
43rd AIAA Aerospace Sciences Meeting and Exhibit |
Reno, NV, United States |
(EI) |