Journal Paper
Year Paper Title Authors Journal Title Issue.No Level Type
2006 “System identification of partially restrained composite plates using measured natural frequency” Tai-Yan Kam /C. R. Lee and T. Y. Kam ASCE, J. Engineering Mechanics No.8 (SCI, EI)
2006 Identification of mechanical properties of elastically restrained laminated composite plates using vibration data Tai-Yan Kam /C. R. Lee and T. Y. Kam J. Sound and Vibration No.3-5 (SCI, EI)
2006 Elastic Constants Identification of Composite Materials Using a Single Angle-Ply Laminate Tai-Yan Kam /C. M. Chen and T. Y. Kam ASCE, J. Engineering Mechanics No.11 (SCI, EI)
2006 “Analysis of Stresses in Adhesive Joints Applicable to IC Chips Using Symbolic Manipulation and the Numerical Method“ Ching-Hua Hung (2026 Retired) ,Tung-Hua Cheng, Ching-Huan Tseng, and Chinghua Hung* Journal of Adhesion Science and Technology No. 15 (SCI, EI)
2006 A self-aligned process between the nano-aperture and solid immersion lens Wen-Syang Hsu ,Hung-Lung Hsu, Yu-Ru Chang, Yi Chiu, Yu-Hsin Lin and Wensyang Hsu Journal of Micromechanics and Microengineering (SCI, EI)
2006 Ni-CNTs Nanocomposite for Robust MEMS Fabrication Wen-Syang Hsu ,Li-Nuan Tsai, Yu-Ting Cheng, Wensyang Hsu, and Weileun Fang J. Vac. Sci. Tech. B. (SCI, EI)
2006 Performance Improvement of an Electrothermal Microactuator Fabricated Using Ni-Diamond Nanocomposite Wen-Syang Hsu ,Li-Nuan Tsai, Guang-Ren Shen, Yu-Ting Cheng and Wensyang Hsu IEEE/ASME Journal of Micro Electro Mechanical Systems 1 (SCI, EI)
2006 A Wafer-Level Hermetic Encapsulation for MEMS Manufacture Application Wen-Syang Hsu ,Zhi-Hao Liang, Yu-Ting Cheng, Wensyang Hsu, Yuh-Wen Lee IEEE Trans. on Adv. Packaging 3 (SCI, EI)
2006 Design and Fabrication of an Electrothermal Microactuator for Multi-level Conveying Wen-Syang Hsu ,Chien-Tai Wu, Wensyang Hsu Journal of Microsystem Technologies 4 (SCI, EI)
2006 Design and Characterization of Electrothermal Monolithic Long-Stretch Micro Drive with High Output Efficiency Wen-Syang Hsu /W. Hsu IEEE/ASME Journal of Micro Electro Mechanical Systems 4 (SCI, EI)