Year	2006
Authors	Wen-Syang Hsu ,Zhi-Hao Liang, Yu-Ting Cheng, Wensyang Hsu, Yuh-Wen Lee
Paper Title	A Wafer-Level Hermetic Encapsulation for MEMS Manufacture Application
Journal Title	IEEE Trans. on Adv. Packaging
Vol.No	29
Issue.No	3
Page(s)	513-519
Level Type	SCI,EI
Total Pages	7
Language	Chinese