NYCU ME| Year | 2006 |
|---|---|
| Authors | Wen-Syang Hsu ,Zhi-Hao Liang, Yu-Ting Cheng, Wensyang Hsu, Yuh-Wen Lee |
| Paper Title | A Wafer-Level Hermetic Encapsulation for MEMS Manufacture Application |
| Journal Title | IEEE Trans. on Adv. Packaging |
| Vol.No | 29 |
| Issue.No | 3 |
| Page(s) | 513-519 |
| Level Type | SCI,EI |
| Total Pages | 7 |
| Language | Chinese |
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