Year 2006
Authors Ching-Hua Hung ,Tung-Hua Cheng, Ching-Huan Tseng, and Chinghua Hung*
Paper Title “Analysis of Stresses in Adhesive Joints Applicable to IC Chips Using Symbolic Manipulation and the Numerical Method“
Journal Title Journal of Adhesion Science and Technology
Vol.No Vol. 20
Issue.No No. 15
Page(s) 1669-1692
Level Type SCI,EI
Language English