Year	2006
Authors	Ching-Hua Hung ,Tung-Hua Cheng, Ching-Huan Tseng, and Chinghua Hung*
Paper Title	“Analysis of Stresses in Adhesive Joints Applicable to IC Chips Using Symbolic Manipulation and the Numerical Method“
Journal Title	Journal of Adhesion Science and Technology
Vol.No	Vol. 20
Issue.No	No. 15
Page(s)	1669-1692
Level Type	SCI,EI
Language	English