| 2015 | Investigation of three-dimension bead aggregation effect for optical sensing in digital microfluidics platform | 徐文祥,Chung, Y.-H., Huang, C.-Y., Tsai, P.-Y., Hsu, H.-Y., and Hsu, W. | Optofluidics 2015 | Taipei, Taiwan |  | 
  
    
      | 2015 | A novel inclined lipid bilayer formation based on DIB method | 徐文祥,Wang, Y.-B., Siao, M.-H., Huang, C.-Y., and Hsu, W. | Optofluidics 2015 | Taipei, Taiwan |  | 
  
    
      | 2015 | Impingement Cooling in a Simulated Data Center Servers with an Array of Elliptic Air Jets | 劉耀先,Chang, S.K., Lo, Y.H., Liu, Y.H. | ASME 2015 InterPACK | San Francisco, California, USA |  | 
  
    
      | 2015 | Decentralized Event-Triggered Control of Networked Systems–Part 2: Containment Control | 程登湖,T. -H Cheng, Zhen Kan, Justin R. Klotz, and Warren E. Dixon | American Control Conference | Chicago, IL |  | 
  
    
      | 2015 | Decentralized Event-Triggered Control of Networked Systems–Part 1: Leader-Follower Consensus under Switching Topologies | 程登湖,T. -H Cheng, Zhen Kan, Justin R. Klotz, and Warren E. Dixon | American Control Conference |  |  | 
  
    
      | 2015 | Embryo lab chip taking advantage of microfluidics and cell co-culturing | 徐文祥,Liu, C.-H., Chang, K.-W., Chang, P.-Y., Sung, Y.-J., Huang, H.-Y., Yao, D.-J., Fan, S.-K., Hsu, W., and Li, C.-J. | IEEE Transducers 2015 | Alaska, USA |  | 
  
    
      | 2015 | A Novel AMR Magnetic Sensor Utilizing Nanoscale Magnetic-Domain Transformation | 鍾添淦,Yu-Jen Chen, Po-Chen Yeh, and Tien-Kan Chung* | IEEE International Magnetic Conference 2015 | Beijing, China | (EI) | 
  
    
      | 2015 | A novel thermomagnetic gripper | 鍾添淦,Chin-Chung Chen, Tien-Kan Chung* | IEEE International Magnetic Conference 2015 | Beijing, China | (EI) | 
  
    
      | 2015 | Investigation of Magnetic Interference to Enhance the System sensitivity of the Self-Powered Piezoelectric Current Sensors Network | 鍾添淦,Chen-Hung Lai, Po-Chen Yeh, and Tien-Kan Chung* | IEEE International Magnetic Conference 2015 | Beijing, China |  | 
  
    
      | 2015 | 3D Printed RF Passive Components by Liquid Metal Filling | 徐文祥,Yang, C., Wu, S.-Y., Glick, C., Choi, Y., Hsu, W., and Lin, L. | IEEE MEMS 2015 | Estoril, Portugal |  |