| 2019 |
Enhanced flow boiling in silicon nanowire-coated manifold microchannels |
陳清榮(2023年退休),Wang, S., Chen, H-H., and Chen, C.L. |
Applied Thermal Engineering |
|
(EI) |
| 2019 |
Vortex dynamics and heat transfer of longitudinal vortex generators in a rectangular channel |
陳清榮(2023年退休),Ke, Z., Chen, C.L., Li, K., Wang, S., and Chen, C.H. |
International Journal of Heat and Mass Transfer |
|
(EI) |
| 2019 |
A Novel Caudal-Fin-Inspired Hourglass-Shaped Self-Agitator for Air-Side Heat Transfer Enhancement in Plate-Fin Heat Exchanger |
陳清榮(2023年退休),Li, K., Wang, S., Ke, Z., and Chen, C. L. |
Energy Conversion and Management |
|
(EI) |
| 2019 |
Condensation Droplet Distribution Regulated by Electrowetting |
陳清榮(2023年退休),Yan, R. and Chen, C.L. |
Journal of Heat Transfer |
|
(EI) |
| 2019 |
On-Chip Cell Incubator for Simultaneous Observation of Culture with and without Periodic Hydrostatic Pressure |
蔡佳宏,M. Horade*, C. D. Tsai and M. Kaneko |
Micromachines |
2 |
(SCI) |
| 2018 |
A New Framework of Disturbance Observer with Vidyasagar's Structure |
黃瑞宇,Yu-Xian Chen, Ruei-Yu Huang, Shih-Chung Chang, Yi-Ren Pan, An-Chen Lee |
中國機械工程學刊 |
6 |
(SCI) |
| 2018 |
Spring-assisted motorized transmission for efficient hover by four flapping wings |
劉義強,Chin, Y.W.*, Ang, Z., Luo, Y., Chan, W.L., Chahl, J.S. and Lau, G.K. |
Journal of Mechanisms and Robotics |
6 |
(SCI) |
| 2018 |
Strain- Mediated Magnetoelectric Storage, Transmission, and Processing: Putting the Squeeze on Data |
鍾添淦,John Domann*, Tao Wu, Tien-Kan Chung, Greg Carman |
MRS BULLETIN (RF: 29/154=18.8%, Physics, Applied. IF: 5.061) |
11 |
(SCI) |
| 2018 |
Virtual Vortex Gear: Unique Flow Patterns Driven by Microfluidic Inertia Leading to Pinpoint Injection |
蔡佳宏,C. D. Tsai*, T. Takayama, Y. Shimozyo, T. Akai, and M. Kaneko |
Biomicrofluidics |
|
(SCI) |
| 2018 |
Constrained Adherable Area of Nanotopographic Surfaces Promotes Cell Migration through the Regulation of Focal Adhesion via Focal Adhesion Kinase/Rac1 Activation |
蔡佳宏,J. Lim, A. Choi, H. W. Kim , H. Yoon, S. M. Park, C. D. Tsai, M. Kaneko, and D. S. Kim* |
ACS Applied Materials & Interfaces |
|
(SCI) |