期刊論文

年度 論文名稱 全部作者 期刊名稱 期數 期刊等級
2018 Virtual Vortex Gear: Unique Flow Patterns Driven by Microfluidic Inertia Leading to Pinpoint Injection 蔡佳宏,C. D. Tsai*, T. Takayama, Y. Shimozyo, T. Akai, and M. Kaneko Biomicrofluidics (SCI)
2018 Constrained Adherable Area of Nanotopographic Surfaces Promotes Cell Migration through the Regulation of Focal Adhesion via Focal Adhesion Kinase/Rac1 Activation 蔡佳宏,J. Lim, A. Choi, H. W. Kim , H. Yoon, S. M. Park, C. D. Tsai, M. Kaneko, and D. S. Kim* ACS Applied Materials & Interfaces (SCI)
2018 LED-CT Scan for pH Distribution on a Cross-Section of Cell Culture Medium 蔡佳宏,N. Higashino, T. Takayama*, H. Ito, M. Horade, Y. Yamaguchi, C. D. Tsai and M. Kaneko Sensors 1 (SCI)
2018 Heat Transfer of Impinging Jet Arrays onto Half-smooth, Half-rough Target Surfaces 劉耀先,Lo, Y.H., Liu Y.H. Applied Thermal Engineering (SCI)
2018 A Rotational-Actuator Using a Thermomagnetic-Induced Magnetic Force Interaction 鍾添淦,Chih-Cheng Cheng, Tien-Kan Chung*, Chin-Chung Chen, and Wang Hsin Min IEEE Transaction on Magnetics (RF: 169/266=63.53%, Engineering, Electrical& Electronic, IF:1.626) 1 (SCI)
2018 Gas-assisted evaporation and boiling in minichannels 傅本然,B.R. Fu, Y.C. Chen, M.X. Ho, Chin Pan* International Journal of Heat and Mass Transfer (SCI)
2018 Moisture prevention in a pre-purged front-opening unified pod (FOUP) during door opening in a mini-environment 傅本然,T. Lin, B.R. Fu*, S.C. Hu*, Y.H. Tang IEEE Transactions on Semiconductor Manufacturing (SCI)
2018 Humidity control for front opening unified pod after opening its door in a mini-environment 傅本然,S.C. Hu, Z.W. Li, T. Lin, B.R. Fu* Applied Sciences (SCI)
2018 Enhancing Adhesion and Polymerization of Lipase-plasma-polymerized-ethylene Coatings Deposited with Planar Dielectric-barrier-discharge-type Aerosol-assisted Atmospheric-pressure Plasma System 鄭雲謙,Yun-Chien Cheng, Chun-Ping Hsiao, Yung-Hsin Liu, Chu-Hao Yang, Chun-Yi Chiang, Yi-Wei Yang, Jong-Shinn Wu* Plasma Processes and Polymers, e1700173, (SCI Ranking  4/31=0.129, IF:2.713)
2018 Using Micro-Molding and Stamping to Fabricate Conductive Polydimethylsiloxane-Based Flexible High-Sensitivity Strain Gauges 鄭雲謙,Chi-Jui Han, Hsuan-Ping Chiang and Yun-Chien Cheng* Sensors, 18, 618. (SCI, 16/61=0.26, Instruments, IF:2.475 )