2018 |
A New Framework of Disturbance Observer with Vidyasagar's Structure |
黃瑞宇,Yu-Xian Chen, Ruei-Yu Huang, Shih-Chung Chang, Yi-Ren Pan, An-Chen Lee |
中國機械工程學刊 |
6 |
(SCI) |
2018 |
Spring-assisted motorized transmission for efficient hover by four flapping wings |
劉義強,Chin, Y.W.*, Ang, Z., Luo, Y., Chan, W.L., Chahl, J.S. and Lau, G.K. |
Journal of Mechanisms and Robotics |
6 |
(SCI) |
2018 |
Strain- Mediated Magnetoelectric Storage, Transmission, and Processing: Putting the Squeeze on Data |
鍾添淦,John Domann*, Tao Wu, Tien-Kan Chung, Greg Carman |
MRS BULLETIN (RF: 29/154=18.8%, Physics, Applied. IF: 5.061) |
11 |
(SCI) |
2018 |
Virtual Vortex Gear: Unique Flow Patterns Driven by Microfluidic Inertia Leading to Pinpoint Injection |
蔡佳宏,C. D. Tsai*, T. Takayama, Y. Shimozyo, T. Akai, and M. Kaneko |
Biomicrofluidics |
|
(SCI) |
2018 |
Constrained Adherable Area of Nanotopographic Surfaces Promotes Cell Migration through the Regulation of Focal Adhesion via Focal Adhesion Kinase/Rac1 Activation |
蔡佳宏,J. Lim, A. Choi, H. W. Kim , H. Yoon, S. M. Park, C. D. Tsai, M. Kaneko, and D. S. Kim* |
ACS Applied Materials & Interfaces |
|
(SCI) |
2018 |
LED-CT Scan for pH Distribution on a Cross-Section of Cell Culture Medium |
蔡佳宏,N. Higashino, T. Takayama*, H. Ito, M. Horade, Y. Yamaguchi, C. D. Tsai and M. Kaneko |
Sensors |
1 |
(SCI) |
2018 |
Heat Transfer of Impinging Jet Arrays onto Half-smooth, Half-rough Target Surfaces |
劉耀先,Lo, Y.H., Liu Y.H. |
Applied Thermal Engineering |
|
(SCI) |
2018 |
A Rotational-Actuator Using a Thermomagnetic-Induced Magnetic Force Interaction |
鍾添淦,Chih-Cheng Cheng, Tien-Kan Chung*, Chin-Chung Chen, and Wang Hsin Min |
IEEE Transaction on Magnetics (RF: 169/266=63.53%, Engineering, Electrical& Electronic, IF:1.626) |
1 |
(SCI) |
2018 |
Gas-assisted evaporation and boiling in minichannels |
傅本然,B.R. Fu, Y.C. Chen, M.X. Ho, Chin Pan* |
International Journal of Heat and Mass Transfer |
|
(SCI) |
2018 |
Moisture prevention in a pre-purged front-opening unified pod (FOUP) during door opening in a mini-environment |
傅本然,T. Lin, B.R. Fu*, S.C. Hu*, Y.H. Tang |
IEEE Transactions on Semiconductor Manufacturing |
|
(SCI) |