| Year | 2010 |
|---|---|
| Authors | Wen-Syang Hsu ,Yang, C.-Y., Cheng, Y.-T. and Hsu, W. |
| Paper Title | The Investigation of Nano-Roughening Effect on the Reliability Enhancement of Adhesive Bond for NEMS Manufacture Application |
| Journal Title | IEEE Trans. on Adv. Packaging |
| Vol.No | 33 |
| Issue.No | 2 |
| Page(s) | 356-361 |
| Level Type | SCI |
| Total Pages | 6 |
| Language | English |
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