Year | 2010 |
---|---|
Authors | Wen-Syang Hsu ,Yang, C.-Y., Cheng, Y.-T. and Hsu, W. |
Paper Title | The Investigation of Nano-Roughening Effect on the Reliability Enhancement of Adhesive Bond for NEMS Manufacture Application |
Journal Title | IEEE Trans. on Adv. Packaging |
Vol.No | 33 |
Issue.No | 2 |
Page(s) | 356-361 |
Level Type | SCI |
Total Pages | 6 |
Language | English |