期刊論文

年度 論文名稱 全部作者 期刊名稱 期數 期刊等級
2017 Numerical investigation of condensation on microstructured surface with wettability patterns 陳清榮(2023年退休),Ke, Z., Shi, J., Zhang, B., and Chen, C.L. International Journal of Heat and Mass Transfer (EI)
2017 Bubble Detachment Assisted by Electrowetting-driven Interfacial Wave 陳清榮(2023年退休),Xu, H., Yan, R., Wang, S., and Chen, C.L. Physics of Fluids (EI)
2017 Performance Analysis of a Near-Field Thermophotovoltaic Device with a Metallodielectric Selective Emitter and Electrical Contacts for the Photovoltaic Cell, 張瑞永,Yang, Y., Chang, J.-Y., Sabbaghi, P., and Wang, L.P., 2017 ASME Journal of Heat Transfer Vol. 139
2017 "Tungsten Nanowire Metamaterials as Selective Solar Thermal Absorbers by Excitation of Magnetic Polaritons" 張瑞永,Chang, J.-Y., Wang, H., and Wang, L.P., 2017 ASME Journal of Heat Transfer
2017 An EWOD-based micro diluter with high flexibility on dilution ratio 黃正昇,Wang, Y-B, Huang, J-H, Lee, M-S, Huang, C-Y, Huang, C-S, Yamashita, I, Tu, Y-Y, Hsu, W Microsystem Technologies
2017 Droplet-based label-free detection system based on guided-mode resonance and electowetting-on-dielectric for concentration measurement 黃正昇,Wang, Y-B, Su, L-Y, Fu, C-S, Huang, C-S*, Hsu, W† Japanese Journal of Applied Physics (SCI)
2017 Real-time CRP detection from whole blood using micropost-embedded microfluidic chip incorporated with label-free biosensor 黃正昇,Tsai, M-Z, Hsiung, C-T, Chen, Y, Huang, C-S*, Hsu, H-Y, Hsieh, P-Y Analyst (SCI)
2017 An EWOD-based micro diluter with high flexibility on dilution ratio 徐文祥,Wang, Y.-B., Huang, J.-H., Lee, M.-S., Huang, C.-Y., Huang, C.-S., Yamashita, I., Tu, Y.-Y., and Hsu, W. Microsystem Technologies
2017 Droplet-based label-free detection system based on guided-mode resonance and electrowetting-on-dielectric for concentration measurement 徐文祥,Wang, Y.-B., Su, L.-Y., Fu, C.-S., Huang, C.-S., and Hsu, W. Japanese Journal of Applied Physics
2016 A Piezoelectric 2-Degree-of- Freedom Nano-Stepping Motor with Parallel Design 洪紹剛,Chiao-Hua Cheng, Shao-Kang Hung IEEE/ASME Transactions on Mechatronics