| Year | 2010 |
|---|---|
| Authors | Tsing-Fa Lin /Chang W. R.; Chen C. A.; Ke J. H.; et al. |
| Paper Title | Subcooled flow boiling heat transfer and associated bubble characteristics of FC-72 on a heated micro-pin-finned silicon chip |
| Journal Title | INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER |
| Vol.No | 53 |
| Issue.No | 23-24 |
| Page(s) | 5605-5621 |
| Level Type | SCI |
| Date of Publication | 2010-11-01 |
| Language | English |
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