Year | 2010 |
---|---|
Authors | Tsing-Fa Lin /Chang W. R.; Chen C. A.; Ke J. H.; et al. |
Paper Title | Subcooled flow boiling heat transfer and associated bubble characteristics of FC-72 on a heated micro-pin-finned silicon chip |
Journal Title | INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER |
Vol.No | 53 |
Issue.No | 23-24 |
Page(s) | 5605-5621 |
Level Type | SCI |
Date of Publication | 2010-11-01 |
Language | English |