Year	2007
Authors	Chi-Chuan Wang ,Chen, Y.S., Chien, K.H., Ferng, Y.M., Wang, C.C., Hung, T.C., and Pei, B.S.
Paper Title	“Numerical and Experimental Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber,”
Journal Title	ASME J. of Electronic Packaging,
Vol.No	129
Page(s)	349-355
Language	Chinese