Journal Paper
Year Paper Title Authors Journal Title Issue.No Level Type
2009 “Nanowires for Enhanced Boiling Heat Transfer” Ming-Chang Lu ,Renkun Chen, Ming-Chang Lu (co-first author), Vinod Srinivasan, Zhijie Wang, Hyung Hee Cho and Arun Majumdar Nano Letters (SCI)
2009 “A Comparative Study of an Open Vertical Refrigerated Multi-Deck – A Numerical Study and its Experimental Validation,” Chi-Chuan Wang ,Chen, Y.F., Lin, H.W., Hsieh, W.D., Lin, J.Y., and Wang, C.C. ASHRAE Transactions Part 2
2009 “System Augmentation of an Air-cooled Chiller Using Nanofluids,” Chi-Chuan Wang ,Liu, M.S., Lin, M. C.C., Hu, R., Liaw, J.S., and Wang, C.C. ASHRAE Transactions Part 1
2009 “Experiments on the Power Consumption Comparison Between a Constant Speed Air-conditioner and a Variable Speed Air-conditioner,” Chi-Chuan Wang ,Chen, I.Y., Chen Y.M., Chang, Y.J., Wei, C.S., and Wang C.C. ASHRAE Transactions Part 1
2009 “Numerical Simulation of a Heat Sink Embedded with a Vapor Chamber and Calculation of Effective Thermal Conductivity of a Vapor Chamber,” Chi-Chuan Wang ,Chen, Y.S., Chien, K.H., Ferng, Y.M., Wang, C.C., Hung, T.C., and Pei, B.S. Applied Thermal Engineering
2009 “Heat Transfer Enhancement by Needle-Arrayed Electrodes - An EHD Integrated Cooling System,” Chi-Chuan Wang ,Sheu, W.J., Huang, R.T., and Wang, C.C. Energy Conversion and Management
2009 “Effect of Variable Heating Load on the Refrigerant Distribution of a Dual Cold-plate System,” Chi-Chuan Wang ,Tien, C.W., Sheu, W.J., Yu, K.H., and Wang, C.C. ASME J. of Electronic Packaging
2009 “Heat Transfer by a Piezoelectric Fan on a Flat Surface Subject to the Influence of Horizontal/Vertical Arrangement,” Chi-Chuan Wang ,Liu, S.F., Huang, R.T., Sheu, W.J., and Wang, C.C. nt. J. of Heat and Mass Transfer
2009 “A Review on Reduction Method for Heat and Mass Transfer of Fin-and-Tube Heat Exchangers Under Dehumidifying Conditions,” Chi-Chuan Wang ,Pirompugd, W., Wang, C.C., and Wongwises, S. Int. J. of Heat and Mass Transfer
2009 “Two-phase Flow Pattern and Frictional Performance Across Small Rectangular Channels,” Chi-Chuan Wang ,Chen, I.Y., Chen, Y.M., Yang, B.C., and Wang, C.C. Applied Thermal Engineering