Year | 2013 |
---|---|
Authors | Stone Cheng,Stone Cheng1, Edward Yi Chang2, Chieh-An Wang1, Hsin-Ping Chou1, Po-Chien Chou1 |
Paper Title | In Depth Thermal Analysis of Packaged GaN on Si Power Devices |
Conference Name | The 25th International Symposium on Power Semiconductor Devices and ICs |
Location | Ishikawa Ongakudo, Kanazawa, JAPAN |
Peroid | May. 26-30, 2013 |
Paper Type | Oral Report |
Sponsor | The Institute of Electrical Engineers of Japan The IEEE Electron Devices Society The IEEE Power Electronics Society |
Author Type | First Author,Corresponding Author |
Number Of Authors | 5 |
Language | English |