Year 2013
Authors Stone Cheng,Stone Cheng1, Edward Yi Chang2, Chieh-An Wang1, Hsin-Ping Chou1, Po-Chien Chou1
Paper Title In Depth Thermal Analysis of Packaged GaN on Si Power Devices
Conference Name The 25th International Symposium on Power Semiconductor Devices and ICs
Location Ishikawa Ongakudo, Kanazawa, JAPAN
Peroid May. 26-30, 2013
Paper Type Oral Report
Sponsor The Institute of Electrical Engineers of Japan The IEEE Electron Devices Society The IEEE Power Electronics Society
Author Type First Author,Corresponding Author
Number Of Authors 5
Language English