Seminar Announcement 2021/03/04 : 3D IC,Advanced Packaging,and Heterogeneous Integration

  • 2021-03-02
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Seminar Speaker: Distinguished Professor Kuan-Neng Chen ,Department of Electronics Engineering ,National Yang Ming Chiao Tung University ,Email:
Title: 3D IC, Advanced Packaging, and Heterogeneous Integration
Date: 2021/03/04 (Thursday) 3:30 pm – 5:20pm
Location: Engineering 5 Building B1 International Conference Hall 
Abstract: 3D integration, advanced packaging, and heterogeneous integration have become more and more significant in current electronic products and applications because of their flexibility and ability to integrate different substrates, functions, devices, and products together with small form factor and low power consumption. These schemes are not only treated as candidates to extend “Moore’s Law”, but also to perform the concept of “More than Moore”. In addition, since current semicondutor development especially fcous on the potential and demands of AI and IOT. 3D Integration, advanced packaging, and advanced packaging provide the solutions to fabrications and platforms of various advanced electronic products. This lecture will start from the introduction of current status, including the history background and current semiconductor status. Schemes of 3D integration and advanced packaging such as 3D, 2.5D (interposer and CoWoS), and 2.1D (fanout and InFO) will be introduced. Key technologies, efforts, current applications, and achievements will be presented as well. Finally, current status, challenges, and outlook will be discussed.     
Biography: Kuan-Neng Chen received his Ph.D. degree in Electrical Engineering and Computer Science, and his M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). He is currently Vice President for International Affairs, Associate Dean of International College of Semiconductor Technology, and Chair Professor of Department of Electronics Engineering and in National Yang Ming Chiao Tung University. Prior to the faculty position, he was a Research Staff Member at the IBM Thomas J. Watson Research Center.
Dr. Chen is the recipient of IEEE EPS Exceptional Technical Achievement Award, MOST Outstanding Research Award, NCTU Distinguished Faculty Awards, NCTU Outstanding Industry-Academia Cooperation Achievement Awards, CIE Outstanding Professor Award, CIEE Outstanding Professor Award, and IBM Invention Plateau Invention Achievement Awards. He has authored more than 300 publications, including 3 books and 6 book chapters, and holds 83 patents. He was Guest Editor of IEEE Transactions on Components, Packaging, and Manufacturing Technology, and MRS Bulletin. He served as General Chair of IEEE IITC and Program Co-Chair of IEEE IPFA, and committee member of IEDM, IEEE 3DIC, IEEE SSDM, IEEE VLSI-TSA, and IMAPS 3D Packaging. Dr. Chen is Fellow of National Academy of Inventors, IEEE, and IET, and member of Phi Tau Phi Scholastic Honor Society. Dr. Chen’s current research interests are three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration.