Year	2009
Authors	Chi-Chuan Wang ,Yang, K.S., Wu, Y.L., Chen, I.Y., and Wang, C.C.
Paper Title	An Investigation of Thermal Spreading Device With Thermal Via in High Power LEDs
Conference Name	IMPACT 2009 (International Microsystems, Packaging, Assembly, and Circuits Technology Conference),
Location	Taipei, Taiwan
Peroid	Oct. 21-23, 2009