| Year | 2015 |
|---|---|
| Authors | Wen-Syang Hsu ,Yang, C., Wu, S.-Y., Glick, C., Choi, Y., Hsu, W., and Lin, L. |
| Paper Title | 3D Printed RF Passive Components by Liquid Metal Filling |
| Conference Name | IEEE MEMS 2015 |
| Location | Estoril, Portugal |
| Peroid | Jan. 18-22, 2015 |
| Paper Type | Conference Papers |
| Language | English |
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