Year | 2015 |
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Authors | Wen-Syang Hsu ,Yang, C., Wu, S.-Y., Glick, C., Choi, Y., Hsu, W., and Lin, L. |
Paper Title | 3D Printed RF Passive Components by Liquid Metal Filling |
Conference Name | IEEE MEMS 2015 |
Location | Estoril, Portugal |
Peroid | Jan. 18-22, 2015 |
Paper Type | Conference Papers |
Language | English |