Year	2013
Authors	Stone Cheng*, Po-Chien Chou, Wei-Hua Chieng, E.Y. Chang
Author Type	First Author,Corresponding Author
Paper Title	Enhanced lateral heat dissipation packaging structure for GaN HEMTs on Si substrate
Journal Title	Applied Thermal Engineering
Issue.No	51
Page(s)	20-24
Level Type	SCI
Date of Publication	2013-01-01
Language	English