| Year | 2008 |
|---|---|
| Authors | Ching-Hua Hung ,Tung-Hua Cheng*, Ching-Huan Tseng and Ching-Hua Hung |
| Paper Title | Application of a Genetic Algorithm Associated With Adhesive Joint Analysis to the IC Chip Pick-up Process |
| Journal Title | Journal of adhesion Science and Technology |
| Vol.No | Vol. 22 |
| Page(s) | 1057-1072 |
| Level Type | SCI,EI |
| Language | English |
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