| Year | 2008 | 
|---|---|
| Authors | Ching-Hua Hung ,Tung-Hua Cheng*, Ching-Huan Tseng and Ching-Hua Hung | 
| Paper Title | Application of a Genetic Algorithm Associated With Adhesive Joint Analysis to the IC Chip Pick-up Process | 
| Journal Title | Journal of adhesion Science and Technology | 
| Vol.No | Vol. 22 | 
| Page(s) | 1057-1072 | 
| Level Type | SCI,EI | 
| Language | English | 
            
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