| Year | 2021 |
|---|---|
| Project Category | Research Projects |
| Project Title | Fast and Patternable Bonding for Microfluidic Chip using Atmospheric Pressure Plasma Jet II |
| Participator | Chia-Hung Dylan Tsai |
| Job Title | Principal Investigator |
| Period | 2021.08 ~ 2022.07 |
| Unit | MOST |
| Language | Chinese |
NYCU ME