| Year | 2009 |
|---|---|
| Project Category | Research Projects |
| Project Title | 60GHz sent the receiver flip-chip multi-chip module packaging technology and equipment development plan, Phase II (III) |
| Participator | Wei-Hua Chieng |
| Job Title | Principle investigator |
| Period | 2009.05 ~ 2010.04 |
| Unit | National Science Council |
| Note | {"en"=>nil, "zh_tw"=>nil} |
| Language | Chinese |
NYCU ME