Year	2013
Authors	Stone Cheng,Stone Cheng1, Edward Yi Chang2, Chieh-An Wang1, Hsin-Ping Chou1, Po-Chien Chou1
Paper Title	In Depth Thermal Analysis of Packaged GaN on Si Power Devices
Conference Name	The 25th International Symposium on Power Semiconductor Devices and ICs
Location	Ishikawa Ongakudo, Kanazawa, JAPAN
Peroid	May. 26-30, 2013
Paper Type	Oral Report
Sponsor	The Institute of Electrical Engineers of Japan The IEEE Electron Devices Society The IEEE Power Electronics Society
Author Type	First Author,Corresponding Author
Number Of Authors	5
Language	English