Journal Paper
Year Paper Title Authors Journal Title Issue.No Level Type
2026 Fu, Ben-Ran (SCI)
2026 Fu, Ben-Ran (SCI)
2025 Fu, Ben-Ran (SCI)
2025 Fu, Ben-Ran (SCI)
2025 Chang Liang-Juan (SCI)
2025 Chang Liang-Juan (SCI)
2025 Chung-Wei, Cheng
2024 Utilizing Flexible Magnetic-Alloy Sheet with Rolling-to-Attaching Method to Fabricate a Smart Nail for Electromagnetic Screw-Hole Targeting in Intramedullary Interlocking-Nail Surgery Tien-Kan (TK) Chung ,Mayank Kohli, Tze-Hong Wong, Wensyang Hsu, Tien-Kan Chung* ASME Journal of Medical Devices. (SCI)
2024 Significant Magnon Contribution to Heat Transfer in Nickel Nanowires Tien-Kan (TK) Chung ,Wei-Tsu Peng, Jiun-Hung Yi, Chih-Cheng Cheng, Kuan-Ju Yu, Tien-Kan Chung*, Ming-Chang Lu* (*co-corresponding author) Materials Today Physics (Ranking: 16/179=8.9%, IF:10, Physics, Applied) (SCI)
2024 A three-probe method for accurate nanoscale thermal transport measurements Tien-Kan (TK) Chung ,Po-Yen Huang, Tzu-Kan Hsiao, Jiun-Hung Yi, Bo-Yi Chen, Yu-Cheng Chiu, I-Ling Chang, Tien-Kan Chung, Ming-Chang Lu*, Chih-Wei Chang* Applied Physics Letter (RF: 48/160=30%, PHYSICS, APPLIED, IF=4.0) (SCI)